December 7, 2017

CDFI Fund: Conference Call on 2018 Bond Guarantee Program Round on December 18th and 19th

On November 1, 2017, the U.S. Department of the Treasury’s Community Development Financial Institutions Fund (CDFI Fund) opened the fiscal year (FY) 2018 application period for the CDFI Bond Guarantee Program.  A total of up to $500 million in bond guarantee authority is available to eligible Community Development Financial Institutions (CDFIs) in FY 2018, pending Congressional authorization.

To provide a forum to applicants of the CDFI Bond Guarantee Program, the CDFI Fund will conduct two one-hour conference calls to answer questions about the application. The calls are not an application workshop or training and no presentation will be given during the calls; only questions from potential applicants will be addressed.

Conference Call Details

Advance registration is not required to attend.

Dates and Times:     Monday, December 18, 2017 from 3:00 to 4:00 p.m. EST
      Tuesday, December 19, 2017 from 10:00 to 11:00 a.m. EST

Call-In Number:             1-877-917-4912

Participant Passcode:   4540093

The call-in phone number and passcode are the same for both conference calls.

Learn More

For more information about the CDFI Bond Guarantee Program, please visit www.cdfifund.gov/bond.

Also available on the CDFI Fund’s website are prerecorded presentations on the CDFI Bond Guarantee Program.  These presentations can be found on the CDFI Bond Guarantee webpage at www.cdfifund.gov/bond under the How To Apply section by clicking Step 2: Apply.

Questions

The last day the CDFI Fund will accept questions regarding the FY 2018 application period for the CDFI Bond Guarantee Program is January 16, 2018, at 11:59 p.m. EST. All questions must be submitted electronically to the program office at bgp@cdfi.treas.gov.

Inquiries regarding legal documents related to the CDFI Bond Guarantee Program should be directed to the CDFI Fund’s Office of Legal Counsel via email at legal@cdfi.treas.gov.

This post was originally published here.